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Reel/Frame:048748/0784   Pages: 3
Recorded: 03/31/2019
Attorney Dkt #:210167.0198.9 (P196)
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
05/05/2020
Application #:
16111727
Filing Dt:
08/24/2018
Publication #:
Pub Dt:
01/10/2019
Title:
OPTICAL COMPONENT PACKAGING STRUCTURE, OPTICAL COMPONENT, OPTICAL MODULE, AND RELATED APPARATUS AND SYSTEM
Assignors
1
Exec Dt:
02/28/2019
2
Exec Dt:
02/28/2019
3
Exec Dt:
02/28/2019
Assignee
1
HUAWEI ADMINISTRATION BUILDING
BANTIAN, LONGGANG DISTRICT, SHENZHEN
GUANGDONG, CHINA 518129
Correspondence name and address
WOMBLE BOND DICKINSON (US) LLP /HUAWEI A
P.O. BOX 7037
ATLANTA, GA 30357-0037

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