Patent Assignment Details
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| Reel/Frame: | 048749/0687 | |
| Pages: | 3 |
| | Recorded: | 04/01/2019 | | |
| Attorney Dkt #: | 919.0080 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/23/2021
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Application #:
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16338505
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Filing Dt:
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04/01/2019
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Publication #:
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Pub Dt:
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12/19/2019
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Title:
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Adhesive Tape for Semiconductor Processing, and Semiconductor Device Manufacturing Method
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Assignee
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| 23-23 HONCHO, ITABASHI-KU |
| TOKYO, JAPAN 173-0001 |
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Correspondence name and address
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CAHN & SAMUELS LLP
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1100 17TH STREET NW
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SUITE 401
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WASHINGTON, DC 20036
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05/03/2024 05:41 PM
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