Patent Assignment Details
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| Reel/Frame: | 048794/0703 | |
| Pages: | 4 |
| | Recorded: | 04/04/2019 | | |
| Attorney Dkt #: | 0941-3824PUS2 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/06/2021
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Application #:
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16373900
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Filing Dt:
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04/03/2019
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Publication #:
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Pub Dt:
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02/20/2020
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Title:
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CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
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Assignee
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| NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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BIRCH, STEWART, KOLASCH & BIRCH, LLP
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8110 GATEHOUSE ROAD, SUITE 100E
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FALLS CHURCH, VA 22042
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