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Reel/Frame:048993/0110   Pages: 5
Recorded: 04/25/2019
Attorney Dkt #:TEL-19002US/216137
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
09/07/2021
Application #:
16394140
Filing Dt:
04/25/2019
Publication #:
Pub Dt:
10/31/2019
Title:
ASSEMBLING APPARATUS AND ASSEMBLING METHOD FOR SEMICONDUCTOR MANUFACTURING APPARATUS
Assignors
1
Exec Dt:
04/19/2019
2
Exec Dt:
04/18/2019
3
Exec Dt:
04/19/2019
4
Exec Dt:
04/19/2019
5
Exec Dt:
04/19/2019
6
Exec Dt:
04/24/2019
7
Exec Dt:
04/19/2019
Assignee
1
3-1 AKASAKA 5-CHOME, MINATO-KU
TOKYO 107-6325, JAPAN
Correspondence name and address
ABELMAN, FRAYNE & SCHWAB/LEE
666 THIRD AVENUE
10TH FLOOR
NEW YORK, NY 10017-4046

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