Patent Assignment Details
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| Reel/Frame: | 049051/0304 | |
| Pages: | 3 |
| | Recorded: | 05/01/2019 | | |
| Attorney Dkt #: | 056777.00112 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16346667
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Filing Dt:
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05/01/2019
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Publication #:
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Pub Dt:
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09/12/2019
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Title:
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Molding Material, Assembly of Molding Materials, Method for Producing Molding Material, and Method for Producing Assembly of Molding Materials
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Assignee
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| 2-4, NAKANOSHIMA 3-CHOME, KITA-KU |
| OSAKA-SHI, OSAKA, JAPAN 530-0005 |
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Correspondence name and address
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BANNER & WITCOFF, LTD.
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1100 13TH ST. NW
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STE 1200
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WASHINGTON, DC 20005
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