Patent Assignment Details
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| Reel/Frame: | 049102/0233 | |
| Pages: | 5 |
| | Recorded: | 04/02/2019 | | |
| Attorney Dkt #: | CU-100308 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE CORRECTION OF ASSIGNOR NAME PREVIOUSLY RECORDED AT REEL: 045872 FRAME: 0567. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15893691
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Filing Dt:
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02/11/2018
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Publication #:
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Pub Dt:
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06/28/2018
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Title:
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EMBEDDED SILICON SUBSTRATE FAN-OUT TYPE PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREFOR
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Assignee
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| 112 LONGTENG ROAD, ECONOMIC & TECHNICAL DEVELOPMENT ZONE |
| JIANGSU |
| KUNSHAN, CHINA 215300 |
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Correspondence name and address
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FLENER IP & BUSINESS LAW
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77 WEST WASHINGTON STREET
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SUITE 800
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CHICAGO, IL 60602
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