Patent Assignment Details
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| Reel/Frame: | 049188/0850 | |
| Pages: | 7 |
| | Recorded: | 05/15/2019 | | |
| Attorney Dkt #: | 16519D1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/15/2022
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Application #:
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16413356
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Filing Dt:
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05/15/2019
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Publication #:
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Pub Dt:
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08/29/2019
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Title:
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METHOD OF MANUFACTURING BONDED SUBSTRATE
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Assignees
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| 11-1, OSAKI 1-CHOME |
| SHINAGAWA-KU |
| TOKYO, JAPAN 141-0032 |
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| 104 TOTSUKAMACHI 1-CHOME |
| SHINJUKU-KU |
| TOKYO, JAPAN 169-8050 |
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| 4-4-37, TAKEDA |
| KOFU-SHI |
| YAMANASHI, JAPAN 400-8510 |
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Correspondence name and address
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HOLTZ, HOLTZ & VOLEK PC
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630 NINTH AVENUE
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SUITE 1010
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NEW YORK, NY 10036
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