Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 049191/0603 | |
| Pages: | 30 |
| | Recorded: | 05/15/2019 | | |
| Attorney Dkt #: | 089994-0010 |
| Conveyance: | MERGER AND CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
6
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Patent #:
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Issue Dt:
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08/13/2019
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Application #:
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14915189
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Filing Dt:
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02/26/2016
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Publication #:
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Pub Dt:
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04/20/2017
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Title:
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SILVER BONDING WIRE FOR SEMICONDUCTOR DEVICE CONTAINING INDIUM, GALLIUM, AND/OR CADMIUM
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Patent #:
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Issue Dt:
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11/07/2017
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Application #:
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15105707
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Filing Dt:
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06/17/2016
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Publication #:
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Pub Dt:
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10/27/2016
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Title:
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BONDING WIRE FOR SEMICONDUCTOR DEVICES
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Patent #:
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NONE
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Issue Dt:
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Application #:
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15329746
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Filing Dt:
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01/27/2017
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Publication #:
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Pub Dt:
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07/27/2017
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Title:
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SOLDER BALL AND ELECTRONIC MEMBER
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Patent #:
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Issue Dt:
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11/17/2020
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Application #:
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15537390
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Filing Dt:
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06/16/2017
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Publication #:
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Pub Dt:
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12/21/2017
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Title:
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BONDING WIRE FOR SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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11/06/2018
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Application #:
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15569603
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Filing Dt:
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10/26/2017
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Publication #:
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Pub Dt:
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04/05/2018
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Title:
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METHOD FOR FORMING BALL IN BONDING WIRE
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Patent #:
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Issue Dt:
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01/07/2020
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Application #:
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16062084
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Filing Dt:
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06/13/2018
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Publication #:
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Pub Dt:
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12/27/2018
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Title:
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BONDING WIRE FOR SEMICONDUCTOR DEVICE
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Assignor
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Newly Merged Entity Data
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Newly Merged Entity's New Name
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| 14-1, SOTOKANDA 4-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 101-0021 |
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Correspondence name and address
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MCDERMOTT WILL & EMERY LLP
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THE MCDERMOTT BUILDING
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500 NORTH CAPITOL STREET, N.W.
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WASHINGTON, DC 20001
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