Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 049219/0448 | |
| Pages: | 20 |
| | Recorded: | 05/17/2019 | | |
| Attorney Dkt #: | 243275.000004 & 000008 |
| Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
2
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Patent #:
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Issue Dt:
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05/03/2016
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Application #:
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12866797
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Filing Dt:
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10/21/2010
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Publication #:
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Pub Dt:
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05/05/2011
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Title:
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BONDING STRUCTURE OF BONDING WIRE
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Patent #:
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Issue Dt:
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08/30/2016
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Application #:
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13380123
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Filing Dt:
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12/22/2011
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Publication #:
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Pub Dt:
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04/19/2012
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Title:
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COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR
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Assignee
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| 14-1, SOTOKANDA 4-CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
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Correspondence name and address
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TROUTMAN SANDERS LLP
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875 THIRD AVENUE
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NEW YORK, NY 10022
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