Patent Assignment Details
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| Reel/Frame: | 049241/0156 | |
| Pages: | 6 |
| | Recorded: | 05/21/2019 | | |
| Attorney Dkt #: | P190505US00 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/12/2021
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Application #:
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16462681
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Filing Dt:
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05/21/2019
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Publication #:
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Pub Dt:
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03/12/2020
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Title:
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HEAT DISSIPATION SUBSTRATE, HEAT DISSIPATION CIRCUIT STRUCTURE BODY, AND METHOD FOR MANUFACTURING THE SAME
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Assignee
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| 3-1, IWATA-CHO 2-CHOME |
| HIGASHIOSAKA-SHI, OSAKA, JAPAN 578-8585 |
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Correspondence name and address
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WESTERMAN HATTORI DANIELS & ADRIAN LLP
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8500 LEESBURG PIKE, SUITE 7500
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TYSONS, VA 22182
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