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Reel/Frame:	049350/0756			Pages:	8
		Recorded:	06/03/2019
Conveyance:	ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Total properties: 233
Page 1 of 3
Pages: 1 2 3

Patent #:	9929100	Issue Dt:	03/27/2018	Application #:	15076174	Filing Dt:	03/21/2016
Publication #:	US20160307847	Pub Dt:	10/20/2016
Title:	ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME

Patent #:	9842789	Issue Dt:	12/12/2017	Application #:	15140775	Filing Dt:	04/28/2016
Publication #:	US20160336249	Pub Dt:	11/17/2016
Title:	ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME

Patent #:	10199337	Issue Dt:	02/05/2019	Application #:	15144162	Filing Dt:	05/02/2016
Publication #:	US20160338202	Pub Dt:	11/17/2016
Title:	ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME

Patent #:	10109588	Issue Dt:	10/23/2018	Application #:	15151885	Filing Dt:	05/11/2016
Publication #:	US20160336296	Pub Dt:	11/17/2016
Title:	ELECTRONIC COMPONENT PACKAGE AND PACKAGE-ON-PACKAGE STRUCTURE INCLUDING THE SAME

Patent #:	9825003	Issue Dt:	11/21/2017	Application #:	15182376	Filing Dt:	06/14/2016
Publication #:	US20170133293	Pub Dt:	05/11/2017
Title:	ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME

Patent #:	9859243	Issue Dt:	01/02/2018	Application #:	15183292	Filing Dt:	06/15/2016
Publication #:	US20170141063	Pub Dt:	05/18/2017
Title:	ELECTRONIC COMPONENT PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME

Patent #:	9905526	Issue Dt:	02/27/2018	Application #:	15192634	Filing Dt:	06/24/2016
Publication #:	US20170125318	Pub Dt:	05/04/2017
Title:	ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME

Patent #:	9831142	Issue Dt:	11/28/2017	Application #:	15200838	Filing Dt:	07/01/2016
Publication #:	US20170133288	Pub Dt:	05/11/2017
Title:	BOARD FOR ELECTRONIC COMPONENT PACKAGE, ELECTRONIC COMPONENT PACKAGE, AND METHOD OF MANUFACTURING BOARD FOR ELECTRONIC COMPONENT PACKAGE

Patent #:	9741630	Issue Dt:	08/22/2017	Application #:	15201990	Filing Dt:	07/05/2016
Publication #:	US20170178984	Pub Dt:	06/22/2017
Title:	ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME

Patent #:	10032697	Issue Dt:	07/24/2018	Application #:	15203006	Filing Dt:	07/06/2016
Publication #:	US20170162527	Pub Dt:	06/08/2017
Title:	ELECTRONIC COMPONENT PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME

Patent #:	10461008	Issue Dt:	10/29/2019	Application #:	15205483	Filing Dt:	07/08/2016
Publication #:	US20170178992	Pub Dt:	06/22/2017
Title:	ELECTRONIC COMPONENT PACKAGE HAVING STRESS ALLEVIATION STRUCTURE

Patent #:	10373884	Issue Dt:	08/06/2019	Application #:	15278248	Filing Dt:	09/28/2016
Publication #:	US20170287853	Pub Dt:	10/05/2017
Title:	FAN-OUT SEMICONDUCTOR PACKAGE FOR PACKAGING SEMICONDUCTOR CHIP AND CAPACITORS

Patent #:	NONE	Issue Dt:		Application #:	15278935	Filing Dt:	09/28/2016
Publication #:	US20170207172	Pub Dt:	07/20/2017
Title:	ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME

Patent #:	10566289	Issue Dt:	02/18/2020	Application #:	15286253	Filing Dt:	10/05/2016
Publication #:	US20170103951	Pub Dt:	04/13/2017
Title:	FAN-OUT SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Patent #:	9984979	Issue Dt:	05/29/2018	Application #:	15297831	Filing Dt:	10/19/2016
Publication #:	US20170040265	Pub Dt:	02/09/2017
Title:	FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Patent #:	NONE	Issue Dt:		Application #:	15335120	Filing Dt:	10/26/2016
Publication #:	US20170154838	Pub Dt:	06/01/2017
Title:	FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Patent #:	10128179	Issue Dt:	11/13/2018	Application #:	15336288	Filing Dt:	10/27/2016
Publication #:	US20170133309	Pub Dt:	05/11/2017
Title:	FAN-OUT SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME

Patent #:	10115648	Issue Dt:	10/30/2018	Application #:	15342281	Filing Dt:	11/03/2016
Publication #:	US20170148699	Pub Dt:	05/25/2017
Title:	FAN-OUT SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME

Patent #:	NONE	Issue Dt:		Application #:	15352060	Filing Dt:	11/15/2016
Publication #:	US20170287825	Pub Dt:	10/05/2017
Title:	FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

Patent #:	10062652	Issue Dt:	08/28/2018	Application #:	15352100	Filing Dt:	11/15/2016
Publication #:	US20170271272	Pub Dt:	09/21/2017
Title:	FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

Patent #:	10340153	Issue Dt:	07/02/2019	Application #:	15352668	Filing Dt:	11/16/2016
Publication #:	US20170263573	Pub Dt:	09/14/2017
Title:	FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

Patent #:	9899331	Issue Dt:	02/20/2018	Application #:	15353249	Filing Dt:	11/16/2016
Publication #:	US20170287839	Pub Dt:	10/05/2017
Title:	FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

Patent #:	9859222	Issue Dt:	01/02/2018	Application #:	15368025	Filing Dt:	12/02/2016
Publication #:	US20170358534	Pub Dt:	12/14/2017
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	NONE	Issue Dt:		Application #:	15369518	Filing Dt:	12/05/2016
Publication #:	US20170365567	Pub Dt:	12/21/2017
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	10600748	Issue Dt:	03/24/2020	Application #:	15377402	Filing Dt:	12/13/2016
Publication #:	US20170365566	Pub Dt:	12/21/2017
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	10818621	Issue Dt:	10/27/2020	Application #:	15381635	Filing Dt:	12/16/2016
Publication #:	US20170278812	Pub Dt:	09/28/2017
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	10325856	Issue Dt:	06/18/2019	Application #:	15385414	Filing Dt:	12/20/2016
Publication #:	US20170213794	Pub Dt:	07/27/2017
Title:	ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME

Patent #:	10403588	Issue Dt:	09/03/2019	Application #:	15402383	Filing Dt:	01/10/2017
Publication #:	US20180090458	Pub Dt:	03/29/2018
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	10573613	Issue Dt:	02/25/2020	Application #:	15404813	Filing Dt:	01/12/2017
Publication #:	US20180061794	Pub Dt:	03/01/2018
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	9881873	Issue Dt:	01/30/2018	Application #:	15420558	Filing Dt:	01/31/2017
Publication #:	US20170365558	Pub Dt:	12/21/2017
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	9824988	Issue Dt:	11/21/2017	Application #:	15432152	Filing Dt:	02/14/2017
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	10276467	Issue Dt:	04/30/2019	Application #:	15440181	Filing Dt:	02/23/2017
Publication #:	US20170278766	Pub Dt:	09/28/2017
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	10892227	Issue Dt:	01/12/2021	Application #:	15441655	Filing Dt:	02/24/2017
Publication #:	US20180096940	Pub Dt:	04/05/2018
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	NONE	Issue Dt:		Application #:	15442927	Filing Dt:	02/27/2017
Publication #:	US20170287796	Pub Dt:	10/05/2017
Title:	ELECTRONIC COMPONENT PACKAGE

Patent #:	10020272	Issue Dt:	07/10/2018	Application #:	15448039	Filing Dt:	03/02/2017
Publication #:	US20170287856	Pub Dt:	10/05/2017
Title:	ELECTRONIC COMPONENT PACKAGE

Patent #:	10431615	Issue Dt:	10/01/2019	Application #:	15449047	Filing Dt:	03/03/2017
Publication #:	US20180090530	Pub Dt:	03/29/2018
Title:	FAN-OUT SENSOR PACKAGE AND CAMERA MODULE INCLUDING THE SAME

Patent #:	10332855	Issue Dt:	06/25/2019	Application #:	15451880	Filing Dt:	03/07/2017
Publication #:	US20170365572	Pub Dt:	12/21/2017
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	9929102	Issue Dt:	03/27/2018	Application #:	15453588	Filing Dt:	03/08/2017
Publication #:	US20180090443	Pub Dt:	03/29/2018
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	9935068	Issue Dt:	04/03/2018	Application #:	15454416	Filing Dt:	03/09/2017
Publication #:	US20170365568	Pub Dt:	12/21/2017
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	10580728	Issue Dt:	03/03/2020	Application #:	15457260	Filing Dt:	03/13/2017
Publication #:	US20170372995	Pub Dt:	12/28/2017
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	10134695	Issue Dt:	11/20/2018	Application #:	15459322	Filing Dt:	03/15/2017
Publication #:	US20180082962	Pub Dt:	03/22/2018
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	10096559	Issue Dt:	10/09/2018	Application #:	15468606	Filing Dt:	03/24/2017
Publication #:	US20180076156	Pub Dt:	03/15/2018
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	10026681	Issue Dt:	07/17/2018	Application #:	15469709	Filing Dt:	03/27/2017
Publication #:	US20180082933	Pub Dt:	03/22/2018
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	10229865	Issue Dt:	03/12/2019	Application #:	15471205	Filing Dt:	03/28/2017
Publication #:	US20170373029	Pub Dt:	12/28/2017
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	9991219	Issue Dt:	06/05/2018	Application #:	15478374	Filing Dt:	04/04/2017
Publication #:	US20170373035	Pub Dt:	12/28/2017
Title:	FAN-OUT SEMICONDUCTOR PACKAGE MODULE

Patent #:	10043772	Issue Dt:	08/07/2018	Application #:	15489117	Filing Dt:	04/17/2017
Publication #:	US20170373030	Pub Dt:	12/28/2017
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	10157868	Issue Dt:	12/18/2018	Application #:	15595226	Filing Dt:	05/15/2017
Publication #:	US20180061795	Pub Dt:	03/01/2018
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	10312205	Issue Dt:	06/04/2019	Application #:	15606467	Filing Dt:	05/26/2017
Publication #:	US20170373027	Pub Dt:	12/28/2017
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	10050016	Issue Dt:	08/14/2018	Application #:	15627957	Filing Dt:	06/20/2017
Publication #:	US20180096968	Pub Dt:	04/05/2018
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	10622322	Issue Dt:	04/14/2020	Application #:	15632138	Filing Dt:	06/23/2017
Publication #:	US20180122759	Pub Dt:	05/03/2018
Title:	FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE FAN-OUT SEMICONDUCTOR

Patent #:	10170382	Issue Dt:	01/01/2019	Application #:	15633478	Filing Dt:	06/26/2017
Publication #:	US20180090402	Pub Dt:	03/29/2018
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	10283426	Issue Dt:	05/07/2019	Application #:	15637725	Filing Dt:	06/29/2017
Publication #:	US20180102297	Pub Dt:	04/12/2018
Title:	FAN-OUT SEMICONDUCTOR PACKAGE AND PHOTOSENSITIVE RESIN COMPOSITION

Patent #:	10002811	Issue Dt:	06/19/2018	Application #:	15647542	Filing Dt:	07/12/2017
Publication #:	US20170309531	Pub Dt:	10/26/2017
Title:	ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME

Patent #:	10177100	Issue Dt:	01/08/2019	Application #:	15655668	Filing Dt:	07/20/2017
Publication #:	US20180145036	Pub Dt:	05/24/2018
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	10256192	Issue Dt:	04/09/2019	Application #:	15663042	Filing Dt:	07/28/2017
Publication #:	US20180145033	Pub Dt:	05/24/2018
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	10083929	Issue Dt:	09/25/2018	Application #:	15666073	Filing Dt:	08/01/2017
Publication #:	US20180174994	Pub Dt:	06/21/2018
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	10170386	Issue Dt:	01/01/2019	Application #:	15667738	Filing Dt:	08/03/2017
Publication #:	US20170330814	Pub Dt:	11/16/2017
Title:	ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME

Patent #:	10600679	Issue Dt:	03/24/2020	Application #:	15668121	Filing Dt:	08/03/2017
Publication #:	US20180138083	Pub Dt:	05/17/2018
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	9929117	Issue Dt:	03/27/2018	Application #:	15670711	Filing Dt:	08/07/2017
Publication #:	US20170358548	Pub Dt:	12/14/2017
Title:	ELECTRONIC COMPONENT PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME

Patent #:	10026703	Issue Dt:	07/17/2018	Application #:	15679860	Filing Dt:	08/17/2017
Publication #:	US20180047683	Pub Dt:	02/15/2018
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	10043758	Issue Dt:	08/07/2018	Application #:	15689659	Filing Dt:	08/29/2017
Publication #:	US20180226350	Pub Dt:	08/09/2018
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	10096552	Issue Dt:	10/09/2018	Application #:	15689861	Filing Dt:	08/29/2017
Publication #:	US20180190591	Pub Dt:	07/05/2018
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	10304791	Issue Dt:	05/28/2019	Application #:	15707266	Filing Dt:	09/18/2017
Publication #:	US20180033746	Pub Dt:	02/01/2018
Title:	ELECTRONIC COMPONENT PACKAGE

Patent #:	10211136	Issue Dt:	02/19/2019	Application #:	15709162	Filing Dt:	09/19/2017
Publication #:	US20180096927	Pub Dt:	04/05/2018
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	10211149	Issue Dt:	02/19/2019	Application #:	15710374	Filing Dt:	09/20/2017
Publication #:	US20180240751	Pub Dt:	08/23/2018
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	10269721	Issue Dt:	04/23/2019	Application #:	15711819	Filing Dt:	09/21/2017
Publication #:	US20180090444	Pub Dt:	03/29/2018
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	10886230	Issue Dt:	01/05/2021	Application #:	15716301	Filing Dt:	09/26/2017
Publication #:	US20180096941	Pub Dt:	04/05/2018
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	10396049	Issue Dt:	08/27/2019	Application #:	15725179	Filing Dt:	10/04/2017
Publication #:	US20180033751	Pub Dt:	02/01/2018
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	10224288	Issue Dt:	03/05/2019	Application #:	15728064	Filing Dt:	10/09/2017
Publication #:	US20180033733	Pub Dt:	02/01/2018
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	10192844	Issue Dt:	01/29/2019	Application #:	15789685	Filing Dt:	10/20/2017
Publication #:	US20180061801	Pub Dt:	03/01/2018
Title:	FAN-OUT SEMICONDUCTOR PACKAGE MODULE

Patent #:	10109541	Issue Dt:	10/23/2018	Application #:	15796411	Filing Dt:	10/27/2017
Publication #:	US20180068911	Pub Dt:	03/08/2018
Title:	BOARD FOR ELECTRONIC COMPONENT PACKAGE, ELECTRONIC COMPONENT PACKAGE, AND METHOD OF MANUFACTURING BOARD FOR ELECTRONIC COMPONENT PACKAGE

Patent #:	10403579	Issue Dt:	09/03/2019	Application #:	15802131	Filing Dt:	11/02/2017
Publication #:	US20190013276	Pub Dt:	01/10/2019
Title:	SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Patent #:	10026668	Issue Dt:	07/17/2018	Application #:	15802170	Filing Dt:	11/02/2017
Title:	PASSIVATION LAYER HAVING AN OPENING FOR UNDER BUMP METALLURGY

Patent #:	10177103	Issue Dt:	01/08/2019	Application #:	15807075	Filing Dt:	11/08/2017
Publication #:	US20190013282	Pub Dt:	01/10/2019
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	10546794	Issue Dt:	01/28/2020	Application #:	15816519	Filing Dt:	11/17/2017
Publication #:	US20180358277	Pub Dt:	12/13/2018
Title:	METHOD OF REDUCING WARPAGE OF SEMICONDUCTOR PACKAGE SUBSTRATE AND DEVICE FOR REDUCING WARPAGE

Patent #:	10312195	Issue Dt:	06/04/2019	Application #:	15819541	Filing Dt:	11/21/2017
Publication #:	US20190019757	Pub Dt:	01/17/2019
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	10833041	Issue Dt:	11/10/2020	Application #:	15828948	Filing Dt:	12/01/2017
Publication #:	US20190035758	Pub Dt:	01/31/2019
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	10644046	Issue Dt:	05/05/2020	Application #:	15828993	Filing Dt:	12/01/2017
Publication #:	US20180294299	Pub Dt:	10/11/2018
Title:	FAN-OUT SENSOR PACKAGE AND OPTICAL FINGERPRINT SENSOR MODULE INCLUDING THE SAME

Patent #:	NONE	Issue Dt:		Application #:	15829045	Filing Dt:	12/01/2017
Publication #:	US20190027419	Pub Dt:	01/24/2019
Title:	FAN-OUT SEMICONDUCTOR PACKAGE AND PACKAGE SUBSTRATE COMPRISING THE SAME

Patent #:	10096560	Issue Dt:	10/09/2018	Application #:	15837611	Filing Dt:	12/11/2017
Publication #:	US20180102332	Pub Dt:	04/12/2018
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	NONE	Issue Dt:		Application #:	15853014	Filing Dt:	12/22/2017
Publication #:	US20180138127	Pub Dt:	05/17/2018
Title:	ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME

Patent #:	10340245	Issue Dt:	07/02/2019	Application #:	15870593	Filing Dt:	01/12/2018
Publication #:	US20180158791	Pub Dt:	06/07/2018
Title:	FAN-OUT SEMICONDUCTOR PACKAGE MODULE

Patent #:	10256200	Issue Dt:	04/09/2019	Application #:	15877021	Filing Dt:	01/22/2018
Publication #:	US20180145044	Pub Dt:	05/24/2018
Title:	ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME

Patent #:	10242973	Issue Dt:	03/26/2019	Application #:	15882440	Filing Dt:	01/29/2018
Publication #:	US20190013300	Pub Dt:	01/10/2019
Title:	FAN-OUT SEMICONDUCTOR PACKAGE MODULE

Patent #:	11075171	Issue Dt:	07/27/2021	Application #:	15891529	Filing Dt:	02/08/2018
Publication #:	US20190131252	Pub Dt:	05/02/2019
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	10373887	Issue Dt:	08/06/2019	Application #:	15895604	Filing Dt:	02/13/2018
Publication #:	US20190088566	Pub Dt:	03/21/2019
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	10475776	Issue Dt:	11/12/2019	Application #:	15900568	Filing Dt:	02/20/2018
Publication #:	US20190131285	Pub Dt:	05/02/2019
Title:	FAN-OUT SEMICONDUCTOR PACKAGE MODULE

Patent #:	10756023	Issue Dt:	08/25/2020	Application #:	15905046	Filing Dt:	02/26/2018
Publication #:	US20190122993	Pub Dt:	04/25/2019
Title:	SEMICONDUCTOR PACKAGE

Patent #:	10714437	Issue Dt:	07/14/2020	Application #:	15905062	Filing Dt:	02/26/2018
Publication #:	US20180190602	Pub Dt:	07/05/2018
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	10388614	Issue Dt:	08/20/2019	Application #:	15913270	Filing Dt:	03/06/2018
Publication #:	US20180197827	Pub Dt:	07/12/2018
Title:	FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

Patent #:	10665535	Issue Dt:	05/26/2020	Application #:	15913429	Filing Dt:	03/06/2018
Publication #:	US20190131221	Pub Dt:	05/02/2019
Title:	SEMICONDUCTOR PACKAGE

Patent #:	10770418	Issue Dt:	09/08/2020	Application #:	15916785	Filing Dt:	03/09/2018
Publication #:	US20180197832	Pub Dt:	07/12/2018
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	10438884	Issue Dt:	10/08/2019	Application #:	15919507	Filing Dt:	03/13/2018
Publication #:	US20190164876	Pub Dt:	05/30/2019
Title:	CARRIER SUBSTRATE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME

Patent #:	10395088	Issue Dt:	08/27/2019	Application #:	15922348	Filing Dt:	03/15/2018
Publication #:	US20180307890	Pub Dt:	10/25/2018
Title:	FAN-OUT FINGERPRINT SENSOR PACKAGE

Patent #:	10672719	Issue Dt:	06/02/2020	Application #:	15923708	Filing Dt:	03/16/2018
Publication #:	US20190096824	Pub Dt:	03/28/2019
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	10600706	Issue Dt:	03/24/2020	Application #:	15925338	Filing Dt:	03/19/2018
Publication #:	US20190122949	Pub Dt:	04/25/2019
Title:	SEMICONDUCTOR PACKAGE INCLUDING ORGANIC INTERPOSER

Patent #:	10672714	Issue Dt:	06/02/2020	Application #:	15928845	Filing Dt:	03/22/2018
Publication #:	US20190164894	Pub Dt:	05/30/2019
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Patent #:	10192831	Issue Dt:	01/29/2019	Application #:	15933909	Filing Dt:	03/23/2018
Title:	FAN-OUT SEMICONDUCTOR PACKAGE MODULE

Patent #:	10916495	Issue Dt:	02/09/2021	Application #:	15935526	Filing Dt:	03/26/2018
Publication #:	US20190131224	Pub Dt:	05/02/2019
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

100

Patent #:	10304784	Issue Dt:	05/28/2019	Application #:	15938181	Filing Dt:	03/28/2018
Publication #:	US20190096825	Pub Dt:	03/28/2019
Title:	FAN-OUT SEMICONDUCTOR PACKAGE

Assignor

SAMSUNG ELECTRO-MECHANICS CO., LTD.

Exec Dt:

06/01/2019

Assignee

SAMSUNG ELECTRONICS CO., LTD.

129, SAMSUNG-RO, YEONGTONG-GU

SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF

Correspondence name and address
	MORGAN LEWIS & BOCKIUS LLP
	1111 PENNSYLVANIA AVENUE, NW
	WASHINGTON, DC 20004

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