Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 049398/0720 | |
| Pages: | 6 |
| | Recorded: | 06/06/2019 | | |
| Attorney Dkt #: | TI-79096 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
16431613
|
Filing Dt:
|
06/04/2019
|
|
Publication #:
|
|
Pub Dt:
|
12/10/2020
| | | | |
|
Title:
|
REPASSIVATION APPLICATION FOR WAFER-LEVEL CHIP-SCALE PACKAGE
|
|
|
Assignee
|
|
|
|
|
| 12500 TI BOULEVARD, M/S 3999 |
| DALLAS, TEXAS 75243 |
|
|
Correspondence name and address
|
| |
TEXAS INSTRUMENTS INCORPORATED
|
| |
P.O. BOX 655474, MS 3999
|
| |
DALLAS, TX 75265
|
Search Results as of:
04/28/2024 02:40 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
