Patent Assignment Details
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| Reel/Frame: | 049413/0967 | |
| Pages: | 3 |
| | Recorded: | 06/10/2019 | | |
| Attorney Dkt #: | SSUIP-19003-USPT |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/06/2022
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Application #:
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16467108
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Filing Dt:
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06/06/2019
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Publication #:
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Pub Dt:
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03/05/2020
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Title:
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SYSTEM AND METHOD FOR GRANULATING AND MOLDING SILICON LIQUID
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Assignee
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| FLOORS 1-3, BUILDING 5, NO. 200, TIANFU FIFTH STREET |
| HIGH-TECH ZONE |
| CHENGDU, SICHUAN, CHINA |
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Correspondence name and address
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BYIP
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P.O. BOX 1484
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GENERAL POST OFFICE
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HONG KONG, CHINA
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05/02/2024 05:18 PM
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