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Reel/Frame:049418/0782   Pages: 7
Recorded: 06/10/2019
Attorney Dkt #:MI22-6917
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
10/05/2021
Application #:
16435924
Filing Dt:
06/10/2019
Publication #:
Pub Dt:
12/10/2020
Title:
Integrated Assemblies Comprising Spaces Between Bitlines and Comprising Conductive Plates Operationally Proximate the Bitlines, and Methods of Forming Integrated Assemblies
Assignors
1
Exec Dt:
06/10/2019
2
Exec Dt:
06/10/2019
Assignee
1
8000 SOUTH FEDERAL WAY
MS 1-525
BOISE, IDAHO 83716
Correspondence name and address
WELLS ST. JOHN, P.S.
601 W. MAIN AVENUE
SUITE 600
SPOKANE, WA 99201

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