Patent Assignment Details
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| Reel/Frame: | 049433/0252 | |
| Pages: | 5 |
| | Recorded: | 06/11/2019 | | |
| Attorney Dkt #: | 5750/0574PUS1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/04/2022
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Application #:
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16429801
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Filing Dt:
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06/03/2019
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Publication #:
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Pub Dt:
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06/18/2020
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Title:
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WAFER SCALE ULTRASONIC SENSOR ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
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Assignees
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| 9F, NO. 102, SEC. 3, MINQUAN E. RD., SONGSHAN DIST., |
| TAIPEI CITY, TAIWAN 105 |
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| SCHOOL OF ELECTRONICS AND COMPUTER ENGINEERING, PEKING UNIVERSITY SHENZHEN GRADUATE SCHOOL, PEKING UNIVERSITY |
| SHENZHEN, CHINA 518055 |
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Correspondence name and address
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MUNCY, GEISSLER, OLDS & LOWE, PC
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4000 LEGATO RD., SUITE 310
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FAIRFAX, VA 22033
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