Patent Assignment Details
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| Reel/Frame: | 049452/0185 | |
| Pages: | 3 |
| | Recorded: | 06/12/2019 | | |
| Attorney Dkt #: | GUH-334US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/13/2021
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Application #:
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15737523
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Filing Dt:
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06/12/2019
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Publication #:
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Pub Dt:
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10/03/2019
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Title:
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SEMICONDUCTOR STRUCTURE, SEMICONDUCTOR ASSEMBLY AND POWER SEMICONDUCTOR DEVICE
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Assignees
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| NO. 2006 XIYUAN ROAD, HI TECH ZONE (WEST) |
| CHENGDU, SICHUAN, CHINA 611731 |
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| LIANGPING INDUSTRIAL PARK |
| CHONGQING, CHINA 405200 |
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Correspondence name and address
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GLOBAL IP SERVICES
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7285 EAGLE COURT
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WINTON, CA 95388
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