Patent Assignment Details
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| Reel/Frame: | 049476/0846 | |
| Pages: | 12 |
| | Recorded: | 06/14/2019 | | |
| Attorney Dkt #: | SP18-108 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/19/2021
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Application #:
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16376467
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Filing Dt:
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04/05/2019
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Publication #:
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Pub Dt:
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10/10/2019
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Title:
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HERMETIC METALLIZED VIA WITH IMPROVED RELIABILITY
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Assignee
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| SP-TI-3-1 |
| CORNING, NEW YORK 14831 |
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Correspondence name and address
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CORNING INCORPORATED
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SP-TI-3-1
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CORNING, NY 14831
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05/10/2024 02:55 PM
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