Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 049572/0044 | |
| Pages: | 3 |
| | Recorded: | 06/24/2019 | | |
| Attorney Dkt #: | SHIRAI-19010-USPT |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/02/2021
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Application #:
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16429132
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Filing Dt:
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06/03/2019
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Publication #:
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Pub Dt:
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12/03/2020
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Title:
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MEMS Package, MEMS Microphone, Method of Manufacturing the MEMS Package and Method of Manufacturing the MEMS Microphone
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Assignee
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| SAE TECHNOLOGY CENTRE, 6 SCIENCE PARK EAST AVENUE |
| HONG KONG SCIENCE PARK, SHATIN, N.T. |
| HONG KONG, HONG KONG |
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Correspondence name and address
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BYIP
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P.O. BOX 1484
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GENERAL POST OFFICE
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HONG KONG, CHINA
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05/09/2024 11:14 AM
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