Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 049576/0782 | |
| Pages: | 2 |
| | Recorded: | 06/25/2019 | | |
| Attorney Dkt #: | 20369-137765-US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/10/2019
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Application #:
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14963292
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Filing Dt:
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12/09/2015
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Publication #:
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Pub Dt:
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03/31/2016
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Title:
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ADHESIVE COMPOSITION, ELECTRONIC-COMPONENT-MOUNTED SUBSTRATE AND SEMICONDUCTOR DEVICE USING THE ADHESIVE COMPOSITION
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Assignee
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| 9-2, MARUNOUCHI 1-CHOME |
| CHIYODA-KU |
| TOKYO, JAPAN 100-6606 |
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Correspondence name and address
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ALAN E. SCHIAVELLI
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1250 23RD STREET NW, SUITE 410
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WASHINGTON, DC 20037-1164
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