Patent Assignment Details
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Reel/Frame: | 049580/0711 | |
| Pages: | 3 |
| | Recorded: | 06/25/2019 | | |
Attorney Dkt #: | AB5896-US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/22/2023
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Application #:
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16451754
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Filing Dt:
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06/25/2019
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Publication #:
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Pub Dt:
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12/31/2020
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Title:
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MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIAL (SA-TIM)
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Assignee
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2200 MISSION COLLEGE BOULEVARD |
SANTA CLARA, CALIFORNIA 95054 |
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Correspondence name and address
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MICHAEL S. MOORE
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2816 LAGO VISTA LANE
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PATENT CAPITAL GROUP
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ROCKWALL, TX 75032
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