Patent Assignment Details
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| Reel/Frame: | 049663/0678 | |
| Pages: | 7 |
| | Recorded: | 07/03/2019 | | |
| Attorney Dkt #: | MI22-6984 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/04/2022
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Application #:
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16502584
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Filing Dt:
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07/03/2019
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Publication #:
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Pub Dt:
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01/07/2021
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Title:
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Integrated Assemblies Comprising Voids Between Active Regions and Conductive Shield Plates, and Methods of Forming Integrated Assemblies
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Assignee
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| 8000 SOUTH FEDERAL WAY, MS 1- 525 |
| BOISE, IDAHO 83716 |
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Correspondence name and address
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WELLS ST. JOHN P.S.
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601 W. MAIN AVENUE
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SUITE 600
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SPOKANE, WA 99201
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