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09/19/2006
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10688047
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10/17/2003
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Pub Dt:
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04/21/2005
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Title:
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END OF RANGE (EOR) SECONDARY DEFECT ENGINEERING USING SUBSTITUTIONAL CARBON DOPING
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06/27/2006
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10689923
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Filing Dt:
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10/17/2003
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Publication #:
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Pub Dt:
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04/21/2005
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Title:
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INTEGRATED CIRCUIT WITH PROTECTED IMPLANTATION PROFILES AND METHOD FOR THE FORMATION THEREOF
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Patent #:
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11/22/2005
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10690998
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Filing Dt:
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10/22/2003
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Publication #:
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Pub Dt:
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04/28/2005
| | | | |
Title:
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METHOD TO FABRICATE ALIGNED DUAL DAMASCENE OPENINGS
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Patent #:
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Issue Dt:
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11/06/2007
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10778293
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Filing Dt:
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02/13/2004
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Pub Dt:
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08/18/2005
| | | | |
Title:
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METHOD TO FORM A CONTACT HOLE
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Patent #:
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04/01/2008
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10904323
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Filing Dt:
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11/04/2004
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Publication #:
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Pub Dt:
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05/04/2006
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Title:
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MULTIPLE LAYER RESIST SCHEME IMPLEMENTING ETCH RECIPE PARTICULAR TO EACH LAYER
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Patent #:
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09/11/2007
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10913214
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Filing Dt:
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08/06/2004
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Publication #:
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Pub Dt:
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02/09/2006
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Title:
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METHODS FOR ELIMINATION OF ARSENIC BASED DEFECTS IN SEMICONDUCTOR DEVICES WITH ISOLATION REGIONS
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09/18/2007
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11029835
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01/05/2005
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Publication #:
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Pub Dt:
|
07/06/2006
| | | | |
Title:
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HIGH DENSITY PLASMA AND BIAS RF POWER PROCESS TO MAKE STABLE FSG WITH LESS FREE F AND SIN WITH LESS H TO ENHANCE THE FSG/SIN INTEGRATION RELIABILITY
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02/19/2008
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11029881
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01/05/2005
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Pub Dt:
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07/06/2006
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Title:
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METHOD FOR CUO REDUCTION BY USING TWO STEP NITROGEN OXYGEN AND REDUCING PLASMA TREATMENT
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11/20/2007
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11034952
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01/13/2005
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Publication #:
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Pub Dt:
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07/13/2006
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Title:
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METHOD FOR REDUCING ARGON DIFFUSION FROM HIGH DENSITY PLASMA FILMS
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08/14/2007
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11039429
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01/20/2005
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Publication #:
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Pub Dt:
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07/20/2006
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Title:
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LASER ACTIVATION OF IMPLANTED CONTACT PLUG FOR MEMORY BITLINE FABRICATION
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08/14/2007
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11122667
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05/04/2005
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11/09/2006
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Title:
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COMPOSITE STRESS SPACER
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08/07/2007
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11160624
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06/30/2005
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01/04/2007
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Title:
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INTEGRATED CIRCUIT SYSTEM USING DUAL DAMASCENE PROCESS
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06/03/2008
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11161722
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08/15/2005
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Pub Dt:
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02/15/2007
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Title:
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A METHOD FOR USING A CU BEOL PROCESS TO FABRICATE AN INTEGRATED CIRCUIT (IC) ORIGINALLY HAVING AN AL DESIGN
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Patent #:
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10/28/2008
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11182682
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07/16/2005
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Pub Dt:
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01/25/2007
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Title:
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METHOD TO ENGINEER ETCH PROFILES IN SI SUBSTRATE FOR ADVANCED SEMICONDUCTOR DEVICES
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04/28/2009
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11358934
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02/22/2006
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Pub Dt:
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08/23/2007
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Title:
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ENTIRE ENCAPSULATION OF CU INTERCONNECTS USING SELF-ALIGNED CUSIN FILM
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10/28/2008
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11383965
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05/18/2006
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11/22/2007
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Title:
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METHOD OF FORMING SUBSTANTIALLY L-SHAPED SILICIDE CONTACT FOR A SEMICONDUCTOR DEVICE
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03/10/2009
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11421047
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05/30/2006
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10/05/2006
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Title:
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INTEGRATED CIRCUIT WITH PROTECTED IMPLANTATION PROFILES AND METHOD FOR THE FORMATION THEREOF
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07/15/2008
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11462846
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08/07/2006
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11/30/2006
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Title:
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END OF RANGE (EOR) SECONDARY DEFECT ENGINEERING USING CHEMICAL VAPOR DEPOSITION (CVD) SUBSTITUTIONAL CARBON DOPING
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01/31/2012
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11464664
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08/15/2006
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05/29/2008
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Title:
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INTEGRATED CIRCUIT SYSTEM WITH CARBON AND NON-CARBON SILICON
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06/04/2013
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11465793
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08/18/2006
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Pub Dt:
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02/21/2008
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INTEGRATED CIRCUIT SYSTEM EMPLOYING GATE SHIELD AND/OR GROUND SHIELD
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08/12/2008
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11481213
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07/05/2006
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05/29/2008
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05/15/2012
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11556696
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11/05/2006
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05/08/2008
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11/08/2011
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11614961
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12/21/2006
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06/26/2008
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03/12/2013
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08/22/2007
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03/06/2008
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PROCESSING WITH REDUCED LINE END SHORTENING RATIO
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12/04/2012
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11853156
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09/11/2007
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03/12/2009
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IMPLEMENTATION OF TEMPERATURE-DEPENDENT PHASE SWITCH LAYER FOR IMPROVED TEMPERATURE UNIFORMITY DURING ANNEALING
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01/15/2013
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12/11/2007
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06/11/2009
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METHOD OF FORMING HIGH-K DIELECTRIC STOP LAYER FOR CONTACT HOLE OPENING
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08/23/2011
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11972809
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01/11/2008
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07/16/2009
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INTEGRATED CIRCUIT SYSTEM EMPLOYING MULTIPLE EXPOSURE DUMMY PATTERNING TECHNOLOGY
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12/25/2012
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03/14/2008
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07/24/2008
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09/25/2012
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03/19/2008
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09/24/2009
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HYBRID ORIENTATION SUBSTRATE WITH STRESS LAYER
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09/06/2011
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04/04/2008
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10/08/2009
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AN INTEGRATED CIRCUIT INCLUDING A STRESSED DIELECTRIC LAYER WITH STABLE STRESS
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05/15/2012
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04/22/2008
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10/22/2009
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04/17/2012
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10/08/2008
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04/08/2010
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04/10/2012
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10/13/2008
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04/15/2010
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METHOD FOR REDUCING SIDEWALL ETCH RESIDUE
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01/24/2012
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05/15/2009
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11/19/2009
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10/11/2011
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05/27/2009
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12/02/2010
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RELIABLE INTERCONNECTION
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09/18/2012
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08/07/2009
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02/10/2011
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LOCALIZED ANNEAL
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10/13/2015
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08/20/2009
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02/24/2011
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05/21/2013
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08/21/2009
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02/24/2011
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Non-volatile memory using pyramidal nanocrystals as electron storage elements
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06/25/2013
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07/22/2010
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01/26/2012
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Semiconductor device with reduced contact resistance and method of manufacturing thereof
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03/26/2013
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06/28/2010
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12/29/2011
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02/14/2012
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12/31/2010
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Title:
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NONE
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13112317
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05/20/2011
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11/22/2012
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NONE
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13225483
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09/05/2011
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12/29/2011
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INTEGRATED CIRCUIT INCLUDING A STRESSED DIELECTRIC LAYER WITH STABLE STRESS
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04/10/2012
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09/19/2011
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03/22/2012
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01/28/2014
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01/19/2012
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07/25/2013
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NONE
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04/11/2012
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10/11/2012
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APPARATUS AND METHODS FOR CLEANING AND DRYING OF WAFERS
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09/02/2014
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13891967
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05/10/2013
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12/12/2013
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NON-VOLATILE MEMORY USING PYRAMIDAL NANOCRYSTALS AS ELECTRON STORAGE ELEMENTS
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08/09/2016
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05/23/2013
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11/28/2013
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VACUUM PUMP CONTROLLER
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03/10/2015
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06/11/2013
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10/17/2013
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SEMICONDUCTOR DEVICE WITH REDUCED CONTACT RESISTANCE AND METHOD OF MANUFACTURING THEREOF
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06/14/2016
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06/26/2013
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10/31/2013
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09/08/2015
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14032203
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09/20/2013
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03/26/2015
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WAFER PROCESSING
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10/06/2015
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09/20/2013
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03/26/2015
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WAFER PROCESSING
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03/22/2016
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10/22/2013
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04/23/2015
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RELIABLE PASSIVATION LAYERS FOR SEMICONDUCTOR DEVICES
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12/08/2015
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11/19/2013
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03/13/2014
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INTEGRATION OF TRENCH MOS WITH LOW VOLTAGE INTEGRATED CIRCUITS
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03/29/2016
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11/26/2013
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05/28/2015
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SEMICONDUCTOR DEVICE AND METHODS FOR FORMING A SEMICONDUCTOR DEVICE
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04/11/2017
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14103780
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12/11/2013
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06/11/2015
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FINFET WITH ISOLATION
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04/05/2016
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12/18/2013
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06/18/2015
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INTEGRATED CIRCUITS HAVING CRACK-STOP STRUCTURES AND METHODS FOR FABRICATING THE SAME
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02/02/2016
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12/19/2013
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06/25/2015
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06/07/2016
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14140553
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12/26/2013
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07/02/2015
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01/19/2016
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07/02/2015
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12/01/2015
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07/02/2015
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03/15/2016
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08/06/2015
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05/24/2016
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10/01/2015
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06/30/2016
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08/02/2016
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11/24/2016
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05/09/2017
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12/01/2016
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06/06/2017
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06/09/2016
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12/13/2016
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06/30/2016
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04/11/2017
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12/31/2015
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05/26/2016
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02/29/2016
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06/23/2016
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06/13/2017
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02/27/2018
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08/18/2016
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01/14/2020
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05/04/2017
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