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Reel/Frame:049779/0636   Pages: 8
Recorded: 07/17/2019
Attorney Dkt #:038873-1307(IEE190131-US)
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
08/10/2021
Application #:
16512664
Filing Dt:
07/16/2019
Title:
CONDUCTIVE WIRE STRUCTURE AND MANUFACTURING METHOD THEREOF, ARRAY SUBSTRATE AND DISPLAY DEVICE
Assignors
1
Exec Dt:
05/27/2019
2
Exec Dt:
05/27/2019
3
Exec Dt:
05/27/2019
Assignees
1
NO.2177 TONGLINGBEI ROAD
HEFEI, ANHUI, CHINA 230012
2
NO.10 JIUXIANQIAO RD.
CHAOYANG DISTRICT
BEIJING, CHINA 100015
Correspondence name and address
MENG H. PUA
FOLEY & LARDNER LLP
111 HUNTINGTON AVENUE, SUITE 2500
BOSTON, MA 02199

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