Patent Assignment Details
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| Reel/Frame: | 049848/0579 | |
| Pages: | 3 |
| | Recorded: | 07/24/2019 | | |
| Attorney Dkt #: | 1012-2479/2017P51582 US01 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/08/2020
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Application #:
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16520872
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Filing Dt:
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07/24/2019
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Publication #:
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Pub Dt:
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11/14/2019
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Title:
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Molded Semiconductor Package Having a Package-in-Package Structure and Methods of Manufacturing Thereof
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Assignee
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| AM CAMPEON 1-15 |
| NEUBIBERG, GERMANY 85579 |
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Correspondence name and address
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MURPHY, BILAK & HOMILLER/INFINEON TECHNO
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1255 CRESCENT GREEN
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SUITE 200
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CARY, NC 27518
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