Patent Assignment Details
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| Reel/Frame: | 049885/0658 | |
| Pages: | 4 |
| | Recorded: | 07/29/2019 | | |
| Attorney Dkt #: | TSMP20181961US00 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/08/2020
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Application #:
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16415009
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Filing Dt:
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05/17/2019
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Publication #:
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Pub Dt:
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11/19/2020
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Title:
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Dummy Die Placement Without Backside Chipping
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Assignee
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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SLATER MATSIL, LLP
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17950 PRESTON RD., SUITE 1000
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DALLAS, TX 75252
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