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Reel/Frame:050032/0616   Pages: 3
Recorded: 08/13/2019
Attorney Dkt #:87610-US-871-PCT(CA)
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
03/30/2021
Application #:
16533816
Filing Dt:
08/07/2019
Publication #:
Pub Dt:
11/28/2019
Title:
CURABLE COMPOSITION, THERMALLY CONDUCTIVE MATERIAL, AND DEVICE WITH THERMALLY CONDUCTIVE LAYER
Assignors
1
Exec Dt:
04/23/2019
2
Exec Dt:
04/23/2019
Assignee
1
26-30, NISHIAZABU 2-CHOME, MINATO-KU,
TOKYO, JAPAN 106-8620
Correspondence name and address
JCIPRNET
P.O. BOX 600 TAIPEI GUTING
TAIPEI CITY, 10099 TAIWAN

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