Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 050112/0957 | |
| Pages: | 10 |
| | Recorded: | 08/21/2019 | | |
| Attorney Dkt #: | 5703-000043-US-NP |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
16487388
|
Filing Dt:
|
08/20/2019
|
|
Publication #:
|
|
Pub Dt:
|
02/27/2020
| | | | |
|
Title:
|
SOLDER MATERIAL, SOLDER PASTE, FORMED SOLDER AND SOLDER JOINT
|
|
|
Assignee
|
|
|
|
|
| 23, SENJU HASHIDO-CHO |
| ADACHI-KU |
| TOKYO, JAPAN 120-8555 |
|
|
Correspondence name and address
|
| |
HARNESS, DICKEY & PIERCE, P.L.C.
|
| |
P.O. BOX 828
|
| |
MICHAEL E. HILTON
|
| |
BLOOMFIELD HILLS, MI 48303
|
Search Results as of:
04/30/2024 05:48 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
