Patent Assignment Details
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| Reel/Frame: | 050183/0262 | |
| Pages: | 5 |
| | Recorded: | 08/27/2019 | | |
| Attorney Dkt #: | TI-79403 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/21/2021
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Application #:
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16552321
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Filing Dt:
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08/27/2019
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Publication #:
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Pub Dt:
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10/29/2020
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Title:
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METHOD FOR STRIPPING ONE OR MORE LAYERS FROM A SEMICONDUCTOR WAFER
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Assignee
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| 12500 TI BOULEVARD |
| M/S 3999 |
| DALLAS, TEXAS 75243 |
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Correspondence name and address
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JACKI GARNER
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P.O. BOX 655474
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M/S 3999
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DALLAS, TX 75265
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05/17/2024 12:25 PM
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