Patent Assignment Details
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| Reel/Frame: | 050210/0454 | |
| Pages: | 7 |
| | Recorded: | 08/29/2019 | | |
| Attorney Dkt #: | 239/1253_00 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16554926
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Filing Dt:
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08/29/2019
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Publication #:
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Pub Dt:
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07/23/2020
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Title:
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TIN COMPOUND, TIN PRECURSOR COMPOUND FOR FORMING A TIN-CONTAINING LAYER, AND METHODS OF FORMING A THIN LAYER USING THE SAME
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Assignees
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| 129, SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
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| 142, DAEHWA-RO 132BEON-GIL, DAEDEOK-GU |
| DAEJEON, KOREA, REPUBLIC OF 34366 |
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Correspondence name and address
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LEE & MORSE, P.C.
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3141 FAIRVIEW PARK DRIVE
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SUITE 500
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FALLS CHURCH, VA 22042
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