Patent Assignment Details
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| Reel/Frame: | 050292/0802 | |
| Pages: | 4 |
| | Recorded: | 09/06/2019 | | |
| Attorney Dkt #: | 1477000.164US9 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/22/2019
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Application #:
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15766391
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Filing Dt:
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04/06/2018
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Publication #:
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Pub Dt:
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10/18/2018
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Title:
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HEAT-SINK-ATTACHED POWER-MODULE SUBSTRATE AND POWER MODULE
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Assignee
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| 2-3, MARUNOUCHI 3-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 1008117 |
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Correspondence name and address
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LOCKE LORD LLP
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P.O. BOX 55874
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BOSTON, MA 02205
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