Patent Assignment Details
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| Reel/Frame: | 050299/0161 | |
| Pages: | 3 |
| | Recorded: | 09/06/2019 | | |
| Attorney Dkt #: | MIY-0612 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16492074
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Filing Dt:
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09/06/2019
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Publication #:
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Pub Dt:
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04/15/2021
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Title:
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RESIN MOLDED BODY
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Assignee
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| 6-2, NISHI-SHINBASHI 2CHO-ME |
| MINATO-KU, TOKYO, JAPAN 105-0003 |
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Correspondence name and address
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LEE CHENG
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1133 13TH STREET N.W. STE C2
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WASHINGTON, DC 20005
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