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Reel/Frame:050396/0948   Pages: 4
Recorded: 09/17/2019
Attorney Dkt #:1033318-000618
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
04/13/2021
Application #:
16494815
Filing Dt:
09/17/2019
Publication #:
Pub Dt:
03/12/2020
Title:
POWER MODULE HAVING A HOLE IN A LEAD FRAME FOR IMPROVED ADHESION WITH A SEALING RESIN, ELECTRIC POWER CONVERSION DEVICE, AND METHOD FOR PRODUCING POWER MODULE
Assignors
1
Exec Dt:
07/29/2019
2
Exec Dt:
07/30/2019
3
Exec Dt:
07/30/2019
4
Exec Dt:
07/30/2019
Assignee
1
7-3, MARUNOUCHI 2-CHOME
CHIYODA-KU
TOKYO, JAPAN 100-8310
Correspondence name and address
BUCHANAN INGERSOLL & ROONEY PC
1737 KING STREET
SUITE 500
ALEXANDRIA, VA 22314-2727

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