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Reel/Frame:050438/0844   Pages: 5
Recorded: 09/19/2019
Attorney Dkt #:TMR-P0008
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
04/04/2023
Application #:
16576700
Filing Dt:
09/19/2019
Publication #:
Pub Dt:
04/02/2020
Title:
MOLDED SOLDER AND MOLDED SOLDER PRODUCTION METHOD
Assignors
1
Exec Dt:
09/18/2019
2
Exec Dt:
09/19/2019
3
Exec Dt:
09/19/2019
Assignee
1
1-19-43, HIGASHI-OIZUMI, NERIMA-KU
TOKYO, JAPAN 178-8511
Correspondence name and address
MORI & WARD, LLP
2000 DUKE STREET
SUITE 300
ALEXANDRIA, VA 22314

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