Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 050467/0292 | |
| Pages: | 10 |
| | Recorded: | 09/24/2019 | | |
| Attorney Dkt #: | P74596US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/02/2020
|
Application #:
|
16431808
|
Filing Dt:
|
06/05/2019
|
|
Publication #:
|
|
Pub Dt:
|
09/19/2019
| | | | |
|
Title:
|
METHOD FOR FORMING A CHIP PACKAGE WITH COMPOUNDS TO IMPROVE THE DURABILITY AND PERFORMANCE OF METAL CONTACT STRUCTURES IN THE CHIP PACKAGE
|
|
|
Assignee
|
|
|
|
|
| AM CAMPEON 1-15 |
| NEUBIBERG, GERMANY 85579 |
|
|
Correspondence name and address
|
| |
VIERING, JENTSCHURA & PARTNER MBB
|
| |
C/O 444 BRICKELL AVENUE
|
| |
SUITE 51270
|
| |
MIAMI, FL 33131
|
Search Results as of:
05/10/2024 03:57 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
