Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 050518/0465 | |
| Pages: | 3 |
| | Recorded: | 09/27/2019 | | |
| Attorney Dkt #: | 10467/008155-US0 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/06/2021
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Application #:
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16498843
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Filing Dt:
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09/27/2019
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Publication #:
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Pub Dt:
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04/16/2020
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Title:
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SOLDER ALLOY, SOLDER PASTE, AND SOLDER JOINT
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Assignee
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| 23, SENJU-HASHIDO-CHO, ADACHI-KU |
| TOKYO, JAPAN 120-8555 |
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Correspondence name and address
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MITSUHIRO HARAGUCHI, LEASON ELLIS LLP
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ONE BARKER AVENUE
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FIFTH FLOOR
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WHITE PLAINS, NY 10601-1526
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