Patent Assignment Details
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Reel/Frame: | 050679/0567 | |
| Pages: | 3 |
| | Recorded: | 10/10/2019 | | |
Attorney Dkt #: | 1012-2545 / 2019P51443 US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/12/2021
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Application #:
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16580748
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Filing Dt:
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09/24/2019
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Publication #:
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Pub Dt:
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03/25/2021
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Title:
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Semiconductor Package with Top or Bottom Side Cooling and Method for Manufacturing the Semiconductor Package
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Assignee
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AM CAMPEON 1-15 |
NEUBIBERG, GERMANY 85579 |
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Correspondence name and address
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MURPHY, BILAK & HOMILLER/INFINEON TECHNO
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1255 CRESCENT GREEN
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SUITE 200
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CARY, NC 27518
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05/11/2024 05:41 PM
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