Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 050828/0071 | |
| Pages: | 7 |
| | Recorded: | 10/25/2019 | | |
Attorney Dkt #: | SP17-040 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
|
Issue Dt:
|
04/18/2023
|
Application #:
|
16608500
|
Filing Dt:
|
10/25/2019
|
Title:
|
GLASS ELECTROCHEMICAL SENSOR WITH WAFER LEVEL STACKING AND THROUGH GLASS VIA (TGV) INTERCONNECTS
|
|
Assignee
|
|
|
SP-TI-03-1 |
CORNING, NEW YORK 14831 |
|
Correspondence name and address
|
|
CORNING INCORPORATED
|
|
SP-TI-3-1
|
|
CORNING, NY 14831
|
Search Results as of:
05/13/2024 09:36 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|