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Patent Assignment Details
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Reel/Frame:050865/0554   Pages: 7
Recorded: 10/29/2019
Conveyance: SECURITY AGREEMENT
Total properties: 3
1
Patent #:
Issue Dt:
10/01/2019
Application #:
15403278
Filing Dt:
01/11/2017
Publication #:
Pub Dt:
08/10/2017
Title:
HYBRID LAY-UP MOLD
2
Patent #:
Issue Dt:
07/24/2018
Application #:
15485588
Filing Dt:
04/12/2017
Title:
ONE-CLICK CONFERENCE CALLING
3
Patent #:
Issue Dt:
03/24/2020
Application #:
16420301
Filing Dt:
05/23/2019
Publication #:
Pub Dt:
11/28/2019
Title:
HYBRID LAY-UP MOLD
Assignor
1
Exec Dt:
10/25/2019
Assignee
1
300 PARK AVENUE
4TH FLOOR
NEW YORK, NEW YORK 10022
Correspondence name and address
CT CORPORATION
4400 EASTON COMMONS WAY
SUITE 125
COLUMBUS, OH 43219

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