Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 050870/0799 | |
| Pages: | 8 |
| | Recorded: | 10/31/2019 | | |
| Attorney Dkt #: | LSG034-US-NP |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/08/2022
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Application #:
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16669531
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Filing Dt:
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10/31/2019
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Publication #:
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Pub Dt:
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05/06/2021
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Title:
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BOND PADS OF SEMICONDUCTOR DEVICES
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Assignee
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| 60 WOODLANDS INDUSTRIAL PARK D STREET 2 |
| SINGAPORE, SINGAPORE 738406 |
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Correspondence name and address
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GLOBALFOUNDRIES, INC.
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SANTA CLARA GATEWAY
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2600 GREAT AMERICA WAY
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SANTA CLARA, CA 95054
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05/09/2024 03:31 AM
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