Patent Assignment Details
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| Reel/Frame: | 050957/0149 | |
| Pages: | 4 |
| | Recorded: | 11/08/2019 | | |
| Attorney Dkt #: | 2018-0915/24061.3774US01 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/03/2021
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Application #:
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16559302
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Filing Dt:
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09/03/2019
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Publication #:
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Pub Dt:
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04/02/2020
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Title:
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Dicing Method for Stacked Semiconductor Devices
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Assignee
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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HAYNES AND BOONE, LLP (24061) IP SECTION
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2323 VICTORY AVENUE
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SUITE 700
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DALLAS, TX 75219
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05/11/2024 09:57 PM
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