Patent Assignment Details
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| Reel/Frame: | 051056/0483 | |
| Pages: | 10 |
| | Recorded: | 11/19/2019 | | |
| Attorney Dkt #: | FIS920090139US2 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/15/2015
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Application #:
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13780810
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Filing Dt:
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02/28/2013
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Publication #:
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Pub Dt:
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07/04/2013
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Title:
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BONDED STRUCTURE EMPLOYING METAL SEMICONDUCTOR ALLOY BONDING
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Assignee
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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Correspondence name and address
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INTERNATIONAL BUSINESS MACHINES CORPORATION
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2455 SOUTH ROAD, P386
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ATTN: HILDA HEINLEIN
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POUGHKEEPSIE, NY 12601-5400
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