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Patent Assignment Details

NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Total properties: 15

Patent #:	8610291	Issue Dt:	12/17/2013	Application #:	11848403	Filing Dt:	08/31/2007
Publication #:	US20080061440	Pub Dt:	03/13/2008
Title:	COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE

Patent #:	8097960	Issue Dt:	01/17/2012	Application #:	12146792	Filing Dt:	06/26/2008
Publication #:	US20090072399	Pub Dt:	03/19/2009
Title:	SEMICONDUCTOR MOUNTING BONDING WIRE

Patent #:	8562906	Issue Dt:	10/22/2013	Application #:	12281430	Filing Dt:	12/02/2008
Publication #:	US20090304545	Pub Dt:	12/10/2009
Title:	LEAD-FREE SOLDER ALLOY, SOLDER BALL AND ELECTRONIC MEMBER, AND LEAD-FREE SOLDER ALLOY, SOLDER BALL AND ELECTRONIC MEMBER FOR AUTOMOBILE-MOUNTED ELECTRONIC MEMBER

Patent #:	8415797	Issue Dt:	04/09/2013	Application #:	12294416	Filing Dt:	09/24/2008
Publication #:	US20090115059	Pub Dt:	05/07/2009
Title:	GOLD WIRE FOR SEMICONDUCTOR ELEMENT CONNECTION

Patent #:	8247911	Issue Dt:	08/21/2012	Application #:	12445789	Filing Dt:	06/26/2009
Publication #:	US20100213619	Pub Dt:	08/26/2010
Title:	WIRE BONDING STRUCTURE AND METHOD FOR FORMING SAME

Patent #:	8389860	Issue Dt:	03/05/2013	Application #:	12669612	Filing Dt:	08/05/2010
Publication #:	US20110011619	Pub Dt:	01/20/2011
Title:	BONDING WIRE FOR SEMICONDUCTOR DEVICES

Patent #:	8299356	Issue Dt:	10/30/2012	Application #:	12669662	Filing Dt:	06/25/2010
Publication #:	US20100294532	Pub Dt:	11/25/2010
Title:	BONDING WIRE FOR SEMICONDUCTOR DEVICES

Patent #:	8102061	Issue Dt:	01/24/2012	Application #:	12670253	Filing Dt:	07/27/2010
Publication #:	US20100327450	Pub Dt:	12/30/2010
Title:	SEMICONDUCTOR DEVICE BONDING WIRE AND WIRE BONDING METHOD

Patent #:	7952028	Issue Dt:	05/31/2011	Application #:	12747434	Filing Dt:	06/10/2010
Publication #:	US20100282495	Pub Dt:	11/11/2010
Title:	BONDING WIRE FOR SEMICONDUCTOR DEVICE

Patent #:	8004094	Issue Dt:	08/23/2011	Application #:	12892122	Filing Dt:	09/28/2010
Publication #:	US20110011618	Pub Dt:	01/20/2011
Title:	COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE

Patent #:	8815019	Issue Dt:	08/26/2014	Application #:	12993401	Filing Dt:	02/01/2011
Publication #:	US20110120594	Pub Dt:	05/26/2011
Title:	BONDING WIRE FOR SEMICONDUCTOR

Patent #:	9112059	Issue Dt:	08/18/2015	Application #:	13349155	Filing Dt:	01/12/2012
Publication #:	US20120104613	Pub Dt:	05/03/2012
Title:	BONDING WIRE FOR SEMICONDUCTOR DEVICE

Patent #:	9024442	Issue Dt:	05/05/2015	Application #:	13508864	Filing Dt:	05/09/2012
Publication #:	US20120223430	Pub Dt:	09/06/2012
Title:	SOLDER BALL FOR SEMICONDUCTOR PACKAGING AND ELECTRONIC MEMBER USING THE SAME

Patent #:	8653668	Issue Dt:	02/18/2014	Application #:	13577199	Filing Dt:	08/03/2012
Publication #:	US20120299182	Pub Dt:	11/29/2012
Title:	COPPER BONDING WIRE FOR SEMICONDUCTOR DEVICE AND BONDING STRUCTURE THEREOF

Patent #:	8836147	Issue Dt:	09/16/2014	Application #:	13877224	Filing Dt:	04/01/2013
Publication #:	US20130180757	Pub Dt:	07/18/2013
Title:	BONDING STRUCTURE OF MULTILAYER COPPER BONDING WIRE

Assignor

Exec Dt:

05/27/2019

Assignee

13-1, NIHONBASHI 1-CHOME, CHUO-KU

TOKYO, JAPAN 103-0027

Correspondence name and address
	TROUTMAN SANDERS LLP
	875 THIRD AVENUE
	NEW YORK, NY 10022

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