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Reel/Frame:051099/0942   Pages: 8
Recorded: 11/25/2019
Attorney Dkt #:5867.064US1
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
03/08/2022
Application #:
16095276
Filing Dt:
10/19/2018
Publication #:
Pub Dt:
05/09/2019
Title:
MECHANICALLY-COMPLIANT AND ELECTRICALLY AND THERMALLY CONDUCTIVE LEADFRAMES FOR COMPONENT-ON-PACKAGE CIRCUITS
Assignors
1
Exec Dt:
11/12/2018
2
Exec Dt:
11/12/2019
3
Exec Dt:
11/01/2019
Assignee
1
ONE TECHNOLOGY WAY
NORWOOD, MASSACHUSETTS 02062
Correspondence name and address
SCHWEGMAN LUNDBERG & WOESSNER, P.A.
P.O. BOX 2938
MINNEAPOLIS, MN 55402

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