Patent Assignment Details
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| Reel/Frame: | 051137/0061 | |
| Pages: | 6 |
| | Recorded: | 11/28/2019 | | |
| Attorney Dkt #: | 77429-US-1781-PCT |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/30/2021
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Application #:
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16499869
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Filing Dt:
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11/05/2019
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Publication #:
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Pub Dt:
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03/26/2020
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Title:
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BONDING APPARATUS AND BONDING METHOD
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Assignee
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| 51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI, |
| TOKYO, JAPAN 208-8585 |
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Correspondence name and address
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JCIPRNET
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P.O. BOX 600 TAIPEI GUTING
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TAIPEI CITY, 10099 TAIWAN
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