Patent Assignment Details
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| Reel/Frame: | 051147/0396 | |
| Pages: | 3 |
| | Recorded: | 12/02/2019 | | |
| Attorney Dkt #: | 11274.0030-00000 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16698238
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Filing Dt:
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11/27/2019
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Publication #:
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Pub Dt:
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03/19/2020
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Title:
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SUBSTRATE BONDING METHOD, MULTILAYER SUBSTRATE MANUFACTURING METHOD, MULTILAYER SUBSTRATE MANUFACTURING APPARATUS, AND MULTILAYER SUBSTRATE MANUFACTURING SYSTEM
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Assignee
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| 15-3, KONAN 2-CHOME, MINATO-KU |
| TOKYO, JAPAN 108-6290 |
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Correspondence name and address
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FINNEGAN
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901 NEW YORK AVENUE, NW
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WASHINGTON, DC 20001
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