Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 051152/0904 | |
| Pages: | 5 |
| | Recorded: | 12/02/2019 | | |
| Attorney Dkt #: | 20370-148279-US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16618697
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Filing Dt:
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12/02/2019
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Publication #:
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Pub Dt:
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06/18/2020
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Title:
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LIQUID RESIN COMPOSITION FOR SEALING AND ELECTRONIC COMPONENT APPARATUS
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Assignees
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| 9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-6606 |
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| 3993, NIGORIKAWA, KITA-KU, NIIGATA-SHI |
| NIIGATA, JAPAN 950-3131 |
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Correspondence name and address
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FITCH, EVEN, TABIN & FLANNERY, LLP
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120 SOUTH LASALLE STREET, SUITE 2100
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CHICAGO, IL 60603-3406
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