Patent Assignment Details
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| Reel/Frame: | 051171/0879 | |
| Pages: | 8 |
| | Recorded: | 12/04/2019 | | |
| Attorney Dkt #: | P190968US00 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/01/2022
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Application #:
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16495282
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Filing Dt:
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12/02/2019
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Publication #:
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Pub Dt:
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03/26/2020
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Title:
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METHOD FOR MANUFACTURING REFORMED SIC WAFER, EPITAXIAL LAYER-ATTACHED SIC WAFER, METHOD FOR MANUFACTURING SAME, AND SURFACE TREATMENT METHOD
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Assignee
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| 7-12, TAKESHIMA 5-CHOME, NISHIYODOGAWA-KU |
| OSAKA-SHI, OSAKA, JAPAN 555-0011 |
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Correspondence name and address
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WESTERMAN, HATTORI, DANIELS & ADRIAN LLP
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1250 CONNECTICUT AVENUE NW,
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SUITE 700
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WASHINGTON, DC 20036
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04/29/2024 05:29 AM
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