Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 051178/0641 | |
| Pages: | 2 |
| | Recorded: | 12/04/2019 | | |
| Attorney Dkt #: | 071039.00012 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/12/2022
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Application #:
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16619343
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Filing Dt:
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12/04/2019
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Publication #:
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Pub Dt:
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04/16/2020
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Title:
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CURABLE SILICONE COMPOSITION FOR DIE BONDING USE
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Assignee
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| 5-1, OTEMACHI 1-CHOME |
| CHIYODA-KU |
| TOKYO, JAPAN 100-0004 |
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Correspondence name and address
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DAVID M. LAPRAIRIE
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HOWARD & HOWARD ATTORNEYS PLLC
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450 WEST FOURTH STREET
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ROYAL OAK, MI 48067
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