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Patent Assignment Details
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Reel/Frame:051407/0565   Pages: 3
Recorded: 01/03/2020
Attorney Dkt #:9184-2
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
15312622
Filing Dt:
11/18/2016
Publication #:
Pub Dt:
03/23/2017
Title:
A SILICON CARBIDE SEMICONDUCTOR MODULE FOR THERMAL APPLICATION
Assignors
1
Exec Dt:
12/31/2019
2
Exec Dt:
12/31/2019
Assignee
1
NO.3 BUILDING NO.818
KAIFA ROAD
TAIZHOU CITY, ZHEJIANG, CHINA 318000
Correspondence name and address
ASPIRE IP, LLC
6 N. TEJON ST.
SUITE 400
COLORADO SPRINGS, CO 80903

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