Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 051448/0514 | |
| Pages: | 6 |
| | Recorded: | 01/08/2020 | | |
| Attorney Dkt #: | 20370-148448-US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/12/2023
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Application #:
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16736997
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Filing Dt:
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01/08/2020
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Publication #:
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Pub Dt:
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05/07/2020
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Title:
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EPOXY RESIN COMPOSITION, THERMALLY-CONDUCTIVE MATERIAL PRECURSOR, B-STAGE SHEET, PREPREG, HEAT DISSIPATION MATERIAL, LAMINATE, METAL SUBSTRATE, AND PRINTED CIRCUIT BOARD
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Assignee
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| 9-2, MARUNOUCHI 1-CHOME |
| CHIYODA-KU |
| TOKYO, JAPAN 100-6606 |
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Correspondence name and address
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ALAN E. SCHIAVELLI
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1250 23RD STREET NW, SUITE 410
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WASHINGTON, DC 20037-1164
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05/02/2024 03:31 PM
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